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ISO 4746:1977 PDF
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Oxygen-free copper — Scale adhesion test
Provides a means of assessing the usability in electronic devices, for applications involving glass-to-metal seals, or other uses relying on the formation and presence of an adherent film of copper oxide. The procedure includes preparation and heating in air of a test piece, followed by rapid cooling in water and visual examination for loss of the oxide film or blistering.
| Edition | 1977 |
|---|---|
| Published Date | 1977 |
| Published By | International Standardization Organisation |
| Page Count | 1 |
